Warpage Control of Thin-walled Injection Molding for Handy Communication Devices

碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 102 === The trend of 3C products nowadays is less heavy and better handy. Injection molding, as one of the most used techniques for mass-production in industries, also faces a challenge to produce a thinner product with free of shrinkage and warpage. The causes...

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Bibliographic Details
Main Authors: Chih-Yang Wu, 吳智煬
Other Authors: Ming-Shyan Huang
Format: Others
Language:en_US
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/74633346254543549913