Microstructure Evolution, Reliability Test and Grain Orientation of SnAgCu Solder Joint with Electroless Ni(P)/Pd/Au Under Bump Metallurgy
博士 === 國立清華大學 === 材料科學工程學系 === 102 === Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is widely used as surface finish for metal bond pad in the electronic packaging industries. The widespread adoption of ENEPIG is attributed to its many advantages, and the most important one, it resolves...
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| Format: | Others |
| Language: | en_US |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77853563687336308983 |