Crosstalk-aware TSV Buffer Insertion in 3D IC
碩士 === 國立清華大學 === 資訊工程學系 === 102 === 3D integration is one of the promising technology to alleviate interconnection delay. Implementing 3D IC is to integrate 2D ICs with through-silicon vias (TSVs). For yield consideration, TSVs are bundled together as a TSV block. Regrettably, this placement result...
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| Format: | Others |
| Language: | en_US |
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2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93338229361935437051 |