Effect of temperature gradient on the growth of Ag3Sn intermetallic compounds in Pb-free solder during liquid-state and solid state aging process
碩士 === 國立清華大學 === 工程與系統科學系 === 102 === Three-dimensional integrated circuit (3DIC) technology has become the major trend of electronic packaging in microelectronic industry. To effectively remove heat in stacked ICs, the temperature gradient must be established across the chips. Furthermore, because...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38413774877087259321 |