Enhanced electromigration resistance of Pb-free solders by using Cu/Sn composite structure
碩士 === 國立清華大學 === 工程與系統科學系 === 102 === Electromigration induced failure has been regarded as a serious reliability issue in the Pb-free electronic packaging application. Due to the unique bump-to-line configuration in solder joints, the dominant failure mechanism has been reported as pancake-type vo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/30428960024274654753 |