Effects of anisotropic Beta-Sn alloys on Cu diffusion under a temperature gradient
碩士 === 國立清華大學 === 工程與系統科學系 === 102 === As the packaging technology transitions toward the three-dimensional integrated circuit (3D IC), a larger temperature gradient is expected to be established when the heat is dissipated from the surface of the stacking module. Furthermore, one solder bump consis...
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| Format: | Others |
| Language: | en_US |
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2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33735833478425329300 |