Mechanisms of Electromigration-induced Intermetallic Dissolution and Metallization Consumption in Solder Interconnects
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 102 === Electromigration-induced degradation in solder joints can be classified into two types, pancake-type void formation and metallization consumption, which are driven by two different diffusion mechanisms. The void formation is caused by the Sn electromigration...
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| Format: | Others |
| Language: | en_US |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93801542196678435917 |