Evaluations of the Applicability of Ag-alloy Stud Bump on Flip-Chip Assembly
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 102 === These years, the higher gold price has forced a number of groups in industry and academy to develop new wire bonding materials to replace the gold wire. The newly developing Ag alloy wire has a great deal of advantages include either cost or reliability and...
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| Format: | Others |
| Language: | zh-TW |
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2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24794313326940499029 |