Development of LED Wafer-level Packaging Process and Micro-structure Hybrid Lens Mold
碩士 === 國立臺灣大學 === 機械工程學研究所 === 102 === LED has been widely used in illumination and display. However, most LEDs are packaged by dispensing method, which is low in productivity and complicated in process. Developing an efficient packaging technology has become an important issue. Wafer level pack...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73769211034594664707 |