Kinematic Modeling and Simulation of Fixed Diamond Wire Sawing Process
碩士 === 國立臺灣科技大學 === 機械工程系 === 102 === Semiconductor wafer manufacturing always faces the urgent challenges of quality improvement and cost reduction. Wafers are produced through a series of processes including crystal growth, slicing, flattening and cleaning. Wire saw is the main slicing tool in waf...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10849293558640764679 |