Research of Dressing Break-in Time of Polishing Pad for Cu-Chemical Mechanical Polishing Process
碩士 === 國立臺灣科技大學 === 機械工程系 === 102 === Chemical Mechanical Planarization (CMP) has become a critical technology in current integrated circuits planarization process. Polishing pad plays an important role in the CMP process and the pad replacement frequency also affects the entire process throughput a...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2014
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Online Access: | http://ndltd.ncl.edu.tw/handle/82249269065356281776 |