Research of Dressing Break-in Time of Polishing Pad for Cu-Chemical Mechanical Polishing Process
碩士 === 國立臺灣科技大學 === 機械工程系 === 102 === Chemical Mechanical Planarization (CMP) has become a critical technology in current integrated circuits planarization process. Polishing pad plays an important role in the CMP process and the pad replacement frequency also affects the entire process throughput a...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82249269065356281776 |