UV laser processing technology applied heat slug research
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 102 === As the wafer technology enhanced, the devices on the wafer are getting smaller, the integration of the circuits will increase reduces the cost. As the electronic package become thinner and smaller, the high power and high speed circuit filled in...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/ft54u4 |