The evaluation of Single Sided Substrate Design for ball grid array package
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 102 === In this study, a concept of advanced single-sided substrate design rule has been developed to improve five types of the double-sided substrate designs which are currently used in traditional IC packages. In addition, the cost of gold wire requir...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44981776245667872433 |