The study of laser drilling of Epoxy using 1064nm Nd:YAG laser

碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 102 === The purpose of this thesis is to study the laser ablation parameters of Epoxy on Package on Package (POP) process. During the POP process, Laser ablation must be applied on the substrate IC and dig out the solder ball from the Epoxy layer. A mat...

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Bibliographic Details
Main Authors: Yu-ching Ching, 鄭宇欽
Other Authors: Ming-Chang Shih
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/92vbs3