UV laser processing technology applied GaAs wafer sawing reserch
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 102 === GaAs wafer is a brittle material, there are problems in traditional diamond sawing such as die cracking, edge chipping and peeling. Therefore it is important to develop an alternative solution of die sawing for GaAs related device packaging. It...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/agcvx4 |