Studies on The Bump Hardness Performance for Au Bump Replaced by CuNiAu Bump
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 102 === For the requirement on the higher hardness spec and price drop by panel house, the material applied for package is important, In other words, the kind of bump not only reduces the material cost on package, but also performs harder to reduce the bonding...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/h5uy7n |