Studies on The Bump Hardness Performance for Au Bump Replaced by CuNiAu Bump

• Main Authors: Chun-Te Lee, 李俊德
• Other Authors: Hui-Chi Lin
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/h5uy7n

碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 102 === For the requirement on the higher hardness spec and price drop by panel house, the material applied for package is important, In other words, the kind of bump not only reduces the material cost on package, but also performs harder to reduce the bonding force. The purpose of this point is that how the CuNiAu bump replaces Au bump. Besides lowering the cost of package obviously, it also keeps the same characteristic of Au bump and raises bump hardness which is to release the bonding force and stabilize bonding process. In order to confirm hardness performance of CuNiAu bump. There are 3 kinds of collocation for applying the different thickness. DOE plan is to respectively choose 2 kinds of thickness in Cu/Ni/Au metal and then mix 3 anneal conditions. After experiment is completed, bump hardness performance under different combinations will be confirmed by measuring hardness before/after anneal process. Additionally, bump performance is also confirmed by the reliability test. Actually, the authors have finished the Tech evaluation on higher hardness spec.