Study of The Influences of Alloy Wire Bonding Parameters on The Connection Reliabilities in LED Process
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所在職專班 === 102 === In this research, the differences of wire bonding in LED( Light-Emitting Diode) Packaging process are discussed. The feasibility of using the alloy wire to replace the gold wire in the process also estimated through the experiments. The pure gold wire i...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/s5npxf |