Preparation of Silver-Copper Alloy Film by Electroplating and the Application of the Film on Metallization
碩士 === 國立虎尾科技大學 === 材料科學與綠色能源工程研究所 === 102 === In recent years, high aspect ratio process and low-resistance material are increasing needed for intercomection. A wet process has became increasingly importance. Silver has potential to replace copper as an interconnect material became it has a low...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/j3u3mt |