Developing Strain Gauge Technology for the Measurement of PCB Warpage
碩士 === 國立臺北科技大學 === 工業工程與管理系碩士班 === 102 === Printed circuit board(PCB) is Composite materials, it consists of FR-4, Solder Mask and copper. Because of the Coefficient of thermal expansion(CTE) of each material in PCB are different and Close fit. When PCB in reflow oven with Surface Mount Technology...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54uy4z |