A Novel Scheme of TSV-island-based Partitioning and Floorplanning
碩士 === 國立臺北科技大學 === 電機工程系研究所 === 102 === Recently, TSV (Through-Silicon Via) has become a trend in 3D IC packaging technology. However, most researches focus on cost minimization such as reducing the size and wire length. Few researches highlight TSVs interference like capacitance effects, radio fre...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/ac6683 |