Using CAE Analysis to Study the Warpage of Express Card Connector
碩士 === 國立臺北科技大學 === 製造科技研究所 === 102 === This theme is to study the warpage of Express card connectors, which produced by injection molding. Taguchi Method was used for the experimental analysis. This study also utilize L18 (21 × 37) orthogonal array including the eight control factors: injection flo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/3q265e |