Discussion of Supercritical CO2 Copper Electroplating Parameters for Applications in TSV Chip
碩士 === 國立臺北科技大學 === 機電整合研究所 === 102 === This study uses supercritical electroplating for the filling of Though Silicon Vias (TSV) in chips for applications in 3D IC structures, which differs from wires that can only be connected in a 2D plain; the structure in a 3D IC has the advantage that the rang...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4sjamh |