Removal of Airborne Molecular Contamination in Extreme Ultraviolet Lithography pod by Clean Dry Air

碩士 === 國立臺北科技大學 === 能源與冷凍空調工程系碩士班 === 102 === When the rapid development of integrated circuits, the traditional optical 193nm immersion with double exposure technique, the industry can be extended to 32nm ~ 22nm process.But the development of 22nm process uses the following multiple exposure techni...

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Bibliographic Details
Main Authors: YU-JHE SIA, 夏育哲
Other Authors: Shin-Cheng Hu
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/ty6fnw