EBSD and TEM Investigation of Cu-Sn IMC Crystallographic and Microstructural Evolution in the 3D-IC Scale Solder Joints during Isothermal Annealing
碩士 === 元智大學 === 化學工程與材料科學學系 === 102 === The microstructural evolution of Cu/Sn-Ag(~5 μm)/Cu Cu-bump-on-line (CuBOL) joints during isothermal annealing at 180 °C was examined using a field-emission scanning electron microscope equipped with an electron backscatter diffraction (EBSD) system. Cu6Sn5 a...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/psa45g |