Evaluation of Au/Pd(P) Bilayer on the Cu Pads in the Lead-free Soldering Applications
碩士 === 元智大學 === 化學工程與材料科學學系 === 102 === The effect of Au/Pd(P)/Cu solder joint properties for different Pd(P) film thickness is revealed in this study. The Au thickness is fixed at 0.15 μm and Pd(P) thickness (δPd(P)) is 0 / 0.15 / 0.3 / 0.4 μm respectively. As soldering, we use Sn-3Ag-0.5Cu sol...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/3h4rww |