Thermal Crosslinking Catalyst Ink Research and Application of Metal on the Flexible Substrate
碩士 === 國防大學理工學院 === 材料科學與工程碩士班 === 103 === The aim of this study is to fabricated high-resolution metal circuit on polyimide (PI) surface by electroless metal plating. The PI films were prepared by using the simple surface modify and ion exchange process. Then, a novel pH-sensitive ink palladium cat...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02776732067662287321 |