The Study of Life Prediction on Solder Joint in Package
碩士 === 中華大學 === 機械工程學系碩士班 === 103 === The progressing development of IC promotes the electronic components thinner, compact and versatile which makes our lives more convenient. The reliability issue for any particular packaging is important and has to be investigated before mass production. The purp...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/t53hnq |