Simulation for Passivation Si3N4 Crack in Au/Cu Bump Process and Shear Force Analysis Between Sn-xAg/Copper Pillar Interface
碩士 === 中原大學 === 機械工程研究所 === 103 === The study has two subjects, one subject focuses on the thermal stress of wafer level chip scale package subjected to Si3N4 Cracking for the Au/Cu Bumping Process. The finite element analysis (FEA) method is used to simulate its mechanical behavior and material con...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/gvz848 |