An Investigation on Laser Stealth dicing cut on Sapphire Substrates

碩士 === 義守大學 === 機械與自動化工程學系 === 103 === In this research, an advanced picosecond Laser has been applied to machine sapphire substrate, such as sapphire wafer and sapphire glass, to investigate the fundamental theorem as well as industrial application on Laser technique. Parameters used on design of...

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Bibliographic Details
Main Authors: Jian-Siang Huang, 黃建翔
Other Authors: Hsiang-Chen Hsu
Format: Others
Language:zh-TW
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/7ejzq2