Study on Reliability of Reverse Wire Bond and Encapsulant Materials for LED Packages
碩士 === 崑山科技大學 === 光電工程研究所 === 103 === In this thesis, we study the effects of reverse wire bond and encapsulant materials on the reliability of LED packages.Because the lack of study on the reliability and characteristics for LED package by reverse wire bond in the previous papers,we decide to study...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59252490327480631149 |