Size Measurement of Packing Process with Automatic Optical Inspection
碩士 === 國立高雄應用科技大學 === 電子工程系碩士班 === 103 === In semiconductor packaging process, the design of electronic components product are getting small and thin. The trimming process is getting smaller and thinner, from 5.5mm to 2 mm of molding size. The product of trimming accuracy is getting higher than the...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65972735605896235937 |