Investigation of Alloying Elements Addition on the Microstructures and Mechanical Properties of Sn3.5Ag Lead Free Solders.
碩士 === 國立高雄應用科技大學 === 模具工程系 === 103 === The microstuctures mechanical properties of Sn3.5Ag lead-free solders addition various alloy elements are investigated in the paper. In this study, the Cu(2.5wt.%) Ni(2.5wt.%) and Zn(2.5wt.%) Ga(2.5wt.%) are added to Sn3.5Ag lead-free solders, in which the mic...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13122495289464080367 |