Fabrication and Improved Reliability of Si Bump Stop for Microelectromechanical Systems Sensor Applications

碩士 === 明新科技大學 === 化學工程與材料科技系碩士在職專班 === 103 === In this thesis, a CMOS device based on T company 180 nm technology node design rule with one poly-Si gate and six metal layers was chosen as the subject. The CMOS servers as a control device, which was integrated to a 6-axis sensor through wafer bondi...

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Bibliographic Details
Main Authors: CHIU, SU-PING, 邱素萍
Other Authors: Weng, Wen-Lu
Format: Others
Language:zh-TW
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/26431043638834327054