Chemical Mechanical Polishing parameter of Semiconductor Process relation with Mechanical Torque Influence Analysis
碩士 === 明志科技大學 === 機械工程系機械與機電工程碩士班 === 103 === Chemical Mechanical Polishing (CMP) is an important part in the complicated semiconductor process because of its steady and overall smoothing. The purpose of this thesis is to study the torque for smoothing in the CMP process using different parameters....
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4zttbu |