Through-Hole Filling with Copper Electroplating by Using Different Acids and Anode Materials
碩士 === 國立中興大學 === 化學工程學系所 === 103 === Nowadays, the contact distance between electronic devices has become much shorter with the trend of electronic product miniaturization. To achieve this goal, Electronic devices that have narrow line widths and high density interconnect(HDI) are being vigorously...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72415671412949006613 |