Effective 2.5D IC Chip Module Warpage With Underfill Materoal Design By Analytical Method
碩士 === 國立中興大學 === 物理學系所 === 103 === Three dimensional (3D) stacking technologies have been popular among in high level package that can meet miniaturization trend, high performance, and multi-function electronic products. The interposer where the chips are stacked on is an electrical interface ro...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75659045063355164960 |