Delamination study of lead frame oxidation on lead-typed semiconductor packages
碩士 === 國立成功大學 === 工程科學系碩士在職專班 === 103 === This article is to study the effect of the leadframe oxidation on the delamination inside lead-typed semiconductor packages during packaging assembly processes. As some of the assembly step is operating with high temperature, the leadframe would have oxidati...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25929j |