The Applicability of Using Silver- 95% Alloy Wire for Hybrid Flip Chip Ball Grid Array Packages
碩士 === 國立成功大學 === 工程科學系碩士在職專班 === 103 === The study explores the bonding capability of the silver-95% alloy wire, including the FAB (Free Air Ball) such as the ball roundness, and the first bond quality. The machine trouble shooting such as non-stick on pad, non-stick on lead, and short tail is also...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11999323167683051367 |