The Applicability of Using Silver- 95% Alloy Wire for Hybrid Flip Chip Ball Grid Array Packages

• Main Authors: Kuan-YingChen, 陳冠縈
• Other Authors: Jung-Hua Chou
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/11999323167683051367

碩士 === 國立成功大學 === 工程科學系碩士在職專班 === 103 === The study explores the bonding capability of the silver-95% alloy wire, including the FAB (Free Air Ball) such as the ball roundness, and the first bond quality. The machine trouble shooting such as non-stick on pad, non-stick on lead, and short tail is also examined. The bonding reliability and IMC growth situations are tested and observed to evaluate the quality of the bonds. Experimental results show that the yield of the silver-95% alloy wire FAB made by using 20mA current under the inert gas of 0.25 l/min is better. First bond parameters from the Taguchi experimental design indicate that the silver-95% alloy wire can be applied to Hybrid Flip Chip Ball Grid Array Packages because its reliability bond-ability and work-ability all pass the criteria. Moreover, the working window in descending order is gold wire〉 silver alloy wire〉 copper wire.