EBSD Characterization of Intermetallic Layers in Ag-Pd/Al and Ag-Au-Pd/Al Joints under HTST and HAST Reliability Tests
碩士 === 國立成功大學 === 材料科學及工程學系 === 103 === Gold wire bonding is one of the oldest and most mature process due to its high yields and low processing costs. However, Kirkendall effect in Au/Al interface has been an important issue in gold wire bonding process. With slower IMC layer growth and cheaper cos...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43693789165029753207 |