Ga-doping effect upon Sn-0.7Cu/Cu interfacial reactions and the application of (Cu,Ga) nanoparticles on Cu-to-Cu interconnections
碩士 === 國立成功大學 === 材料科學及工程學系 === 103 === SUMMARY In recent years, soldering and three dimensional integrated-circuit (3D IC) take important parts of electronic packaging technology. Sn-based Pb-free solders have been widely used for low-temperature soldering. However, voids and brittle intermetallic...
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| Format: | Others |
| Language: | zh-TW |
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2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/89413402345227814049 |