Application of In-mold Decoration of Injection Molding in Three-Dimensional Molded Interconnect Devices
博士 === 國立成功大學 === 航空太空工程學系 === 103 === Three Dimensional Molded Interconnect Devices, also known as 3D-MID, integrate both mechanical and electrical functions on plastic substrates. The products are characterized with mechanical structures and electric circuits. This research is based on In-Mold Dec...
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| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23403394113877342313 |