A Kinetic Study of Silver Nitrate and Copper Ion by Replacement Reaction
碩士 === 國立成功大學 === 電機工程學系 === 103 === This study is probing into the kinetic influence in silver-copper replacement reaction. In order to reduce the contact resistance, copper powder contact each other with the binder, silver nanoparticles. Silver nanoparticles will melt at 200℃ before copper powder...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | en_US |
Published: |
2015
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Online Access: | http://ndltd.ncl.edu.tw/handle/85203475350258416869 |