A Kinetic Study of Silver Nitrate and Copper Ion by Replacement Reaction

碩士 === 國立成功大學 === 電機工程學系 === 103 === This study is probing into the kinetic influence in silver-copper replacement reaction. In order to reduce the contact resistance, copper powder contact each other with the binder, silver nanoparticles. Silver nanoparticles will melt at 200℃ before copper powder...

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Bibliographic Details
Main Authors: Wan-LingGong, 龔婉菱
Other Authors: Wen-Hsi Lee
Format: Others
Language:en_US
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/85203475350258416869