Studies on Electrochemical and Barrier Properties of Ruthenium-tungsten and Molybdenum-tungsten Barrier Layers for Advanced Cu Metallization

碩士 === 國立成功大學 === 電機工程學系 === 103

Bibliographic Details
Main Authors: Wei-HsiangLiao, 廖偉翔
Other Authors: Wen-Hsi Lee
Format: Others
Language:en_US
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/45918287641991710221