Effect of Cooling Rate on Mechanical Properties of Sn-xAg-0.7Cu Lead-Free Solder
碩士 === 國立成功大學 === 機械工程學系 === 103 === The effect of the different cooling rates on morphological evolution of the Ag3Sn and Cu6Sn5 formed during the solidification of SAC307、SAC207、SAC157 and SC07 solder was investigated. The tensile tests and hardness tests were used to compare with SAC305. Finally,...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99993671019436048318 |