Electromigration tests in Cu/SnAg/Ni/Cu Flip Chip solder joints and Cu/SnAg/Cu microbumps
碩士 === 國立交通大學 === 材料科學與工程學系所 === 103 === Due to the growing demands for high performance, small form factor and multi-functions in microelectronic packaging for different types of portable electronic devices, 3D stacking is an important issue nowadays in ICs industry. The first part of this stud...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95944968763845461265 |