Investigation of Low Temperature Cu Pillar Thermosonic Bonding for 3D Integration Applications
碩士 === 國立交通大學 === 電子工程學系 電子研究所 === 103 === In response to the current trend of multi-functional electronic products, there has been a growing need for a large number of I/O counts in signal processing chips, resulting in increasing the density of the lead nodes of chip package and reducing the pitch...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45717299790963304438 |