Effect of E-field on oxide in NAND Flash memory retention

碩士 === 國立交通大學 === 電信工程研究所 === 103 ===   Data retention characteristics of program state is different from erase state. There is evident dependence on E-field on oxide for retention test. Through new method can extract the amount of floating gate charge apart from oxide trapped charge by bake. Furthe...

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Main Authors: Chen, Hsuan-Tse, 陳玄澤
Other Authors: Watanabe, Hiroshi
Format: Others
Language:en_US
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/sc6d27
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spelling ndltd-TW-103NCTU54350402019-05-15T21:50:56Z http://ndltd.ncl.edu.tw/handle/sc6d27 Effect of E-field on oxide in NAND Flash memory retention 氧化層電場對NAND快閃記憶體保存度影響之研究 Chen, Hsuan-Tse 陳玄澤 碩士 國立交通大學 電信工程研究所 103   Data retention characteristics of program state is different from erase state. There is evident dependence on E-field on oxide for retention test. Through new method can extract the amount of floating gate charge apart from oxide trapped charge by bake. Furthermore, we can analyze the process of oxide trapped charge shift at different E-field on oxide by bake. When memory cell is at program state before bake, electron detrap should be the main process. When memory cell is at erase state before bake, hole detrap should be the main process. Thus, as a possible model, at erase state for higher E-field on oxide more hole are trapped to oxide near silicon surface. Watanabe, Hiroshi 渡邊浩志 2014 學位論文 ; thesis 32 en_US
collection NDLTD
language en_US
format Others
sources NDLTD
description 碩士 === 國立交通大學 === 電信工程研究所 === 103 ===   Data retention characteristics of program state is different from erase state. There is evident dependence on E-field on oxide for retention test. Through new method can extract the amount of floating gate charge apart from oxide trapped charge by bake. Furthermore, we can analyze the process of oxide trapped charge shift at different E-field on oxide by bake. When memory cell is at program state before bake, electron detrap should be the main process. When memory cell is at erase state before bake, hole detrap should be the main process. Thus, as a possible model, at erase state for higher E-field on oxide more hole are trapped to oxide near silicon surface.
author2 Watanabe, Hiroshi
author_facet Watanabe, Hiroshi
Chen, Hsuan-Tse
陳玄澤
author Chen, Hsuan-Tse
陳玄澤
spellingShingle Chen, Hsuan-Tse
陳玄澤
Effect of E-field on oxide in NAND Flash memory retention
author_sort Chen, Hsuan-Tse
title Effect of E-field on oxide in NAND Flash memory retention
title_short Effect of E-field on oxide in NAND Flash memory retention
title_full Effect of E-field on oxide in NAND Flash memory retention
title_fullStr Effect of E-field on oxide in NAND Flash memory retention
title_full_unstemmed Effect of E-field on oxide in NAND Flash memory retention
title_sort effect of e-field on oxide in nand flash memory retention
publishDate 2014
url http://ndltd.ncl.edu.tw/handle/sc6d27
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