Tr-GIT: A 3-D IC Transient Thermal Simulator using Generalized Integral Transform

碩士 === 國立交通大學 === 電信工程研究所 === 103 === Nowadays, thermal issues caused by high temperature or high temperature gradient are the common bottleneck of the chip performance. Because of the popular multicore architecture and the time-varying workloads of every cores, assuming a steady-state power profile...

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Bibliographic Details
Main Authors: Yang, Chi-Ping, 楊啟平
Other Authors: Yu-Min Lee
Format: Others
Language:en_US
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/5q8zuy